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光學超構表面的歷史、未來及挑戰(zhàn)
212024-05
光學超構表面的歷史、未來及挑戰(zhàn)

據麥姆斯咨詢介紹,近期,ACS Photonics期刊的主編Romain Quidant教授(蘇黎世聯邦理工學院)與哈佛大學的Federico Capasso教授進行了對話,雙方討論了超構表面(Metasurface)的歷史、未來的發(fā)展軌跡及其所面臨的挑戰(zhàn)。以下為麥姆斯咨詢編譯的訪談內容。 Romain Quid……

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Two photon lithography: breaking through the packaging bottleneck of optoelectronic chips
312024-01
Two photon lithography: breaking through the packaging bottleneck of optoelectronic chips

As a rising star in the semiconductor industry, optoelectronic chips have important application prospects in fields such as optical interconnection, optical computing, optical sensing, and LiDAR, and have become a focus of attention from all walks of life, opening up a new track for the development of the post Moore's ……

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New photoresist, listed on Science! Can be used for 3D printing of unprecedented complex structures!
312024-01
New photoresist, listed on Science! Can be used for 3D printing of unprecedented complex structures!

Two photon (or multi photon) lithography technology can achieve polymer nanostructures with almost any geometric shape. Two photon corrosion inhibitors typically use photoinitiators that absorb photons to form reactive species (such as free radicals) that initiate polymerization. High performance two-photon initiators ……

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Why can 3D printing represent the future?
262024-01
Why can 3D printing represent the future?

The potential of 3D printing and additive manufacturing is so enormous that it may disrupt the manufacturing industry as we know it. The most obvious change will be localized production, which may replace or replace traditional distributed manufacturing. Another significant change is the ability for personalized custom……

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The fastest-growing field of semiconductor packaging: automotive grade packaging and 2.5D, 3D packaging
222024-01
The fastest-growing field of semiconductor packaging: automotive grade packaging and 2.5D, 3D packaging

Semiconductor packaging is the last mile of chip production and also a hot innovation topic in the post Moore era. In recent years, with the development of automotive electronics, artificial intelligence and other fields, the requirements for semiconductor packaging have become increasingly high, especially in the auto……

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Facing the gap in the localization level of mask plates, the localization rate of mid to high end mask plates will increase in the future
222024-01
Facing the gap in the localization level of mask plates, the localization rate of mid to high end mask plates will increase in the future

At present, with the promotion of localization, the demand for mask plates by semiconductor companies is constantly increasing; At the same time, semiconductor materials are at the upstream link of the entire industry chain, which will also play an important role in the development of the semiconductor industry

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The supply of key semiconductor materials is in short supply, and the demand for photomask plates in the market is constantly increasing
222024-01
The supply of key semiconductor materials is in short supply, and the demand for photomask plates in the market is constantly increasing

Although the overall prosperity of the semiconductor industry is poor, there is a type of key materials that are in short supply. According to ET News in South Korea, the supply of semiconductor photomasks is in short supply, with several major photomask suppliers holding high orders, including Photonics, Toppan, DN……

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